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Heat Dissipation Module Product List

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Support for copper coin (thermal dissipation structure) wiring board.

Support for copper coin (thermal dissipation structure) wiring board.

We will introduce methods for heat dissipation in printed circuit boards.

As components and enclosures become smaller, the surface area of components decreases, and the lack of area to dissipate heat from ICs needs to be compensated by the substrate. At Oki Electric Industry, we have realized a structure that locally dissipates heat by embedding cylindrical copper into printed circuit boards, maximizing the thermal conductivity of copper (approximately 390W/m·K). 【Features】 ■ Embedding copper coins in heat-generating areas to efficiently utilize copper's thermal conductivity (390W/m·K) for heat dissipation. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Heat Dissipation Module

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Heat dissipation components

Heat dissipation components

We can provide a wide range of proposals tailored to your needs.

【Product Lineup】 Heat Sink Heat Pipe Thermal Conductive Sheet Peltier Element

  • PLC
  • Other electronic parts
  • Signal Generator
  • Heat Dissipation Module

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High thermal conductivity substrate "copper coin"

High thermal conductivity substrate "copper coin"

Improved heat dissipation by embedding copper coins in the circuit board.

Copper coins are components with excellent thermal conductivity. By embedding copper coins into circuit boards, it has become possible to efficiently dissipate heat generated by electronic components on the circuit board to the outside. This is an extremely effective thermal management solution for 5G communication devices, medical equipment, automotive parts, and more. We can process shapes that meet specific needs, with a machining precision of ±0.01mm. Through strict quality control, we guarantee stable and high product quality.

  • Printed Circuit Board
  • Heat Dissipation Module

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[DONGYANG PISTON] Enclosure and others

[DONGYANG PISTON] Enclosure and others

Inclosure/Manifold (FCV) and others

Enclosure/Manifold - Joining of dissimilar materials (aluminum, plastic) Heat dissipation module - Design capability for maximizing cooling efficiency

  • Engine parts
  • Other Auto Parts
  • Heat Dissipation Module

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